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HVM14
Silicon Epitaxial Planar PIN Diode for High Frequency Attenuator
REJ03G0112-0400Z (Previous: ADE-208-082C) Rev.4.00 Oct.08.2003
Features
* Low forward resistance. (rf = 7.0 max) * Low capacitance. (C = 0.25 pF typ) * MPAK package is suitable for high density surface mounting and high speed assembly.
Ordering Information
Type No. HVM14 Laser Mark H5 Package Code MPAK
Pin Arrangement
3
2 1 (Top View)
1. NC 2. Anode 3. Cathode
Rev.4.00, Oct.08.2003, page 1 of 4
HVM14
Absolute Maximum Ratings
(Ta = 25C)
Item Reverse voltage Forward current Power dissipation Junction temperature Storage temperature Symbol VR IF Pd Tj Tstg Value 50 50 100 125 -55 to +125 Unit V mA mW C C
Electrical Characteristics
(Ta = 25C)
Item Forward voltage Reverse current Capacitance Forward resistance ESD-Capability * Note:
1
Symbol VF IR C rf --
Min -- -- -- -- 200
Typ -- -- 0.25 -- --
Max 1.0 100 -- 7.0 --
Unit V nA pF V
Test Condition IF = 50 mA VR = 50 V VR = 50 V, f = 1 MHz IF = 10 mA, f = 100 MHz C = 200 pF, Both forward and reverse direction 1 pulse.
1. Failure criterion; IR 200 nA at VR = 50 V
Rev.4.00, Oct. 08.2003, page 2 of 4
HVM14
Main Characteristic
10-1 10-8
10-3
Reverse current IR (A) Forward current IF (A)
10-9
10-5
10-10
10-7
10
-9
10-11
10-11
0
0.2
0.4
0.6
0.8
1.0
10-12
0
10
20
30
40
50
Forward voltage VF (V) Fig.1 Forward current vs. Forward voltage
Reverse voltage VR (V) Fig.2 Reverse current vs. Reverse voltage 104
f = 1MHz
f = 100MHz
Forward resistance rf ()
10
Capacitance C (pF)
103
102
1.0
10
0.1 1.0
10 Reverse voltage VR (V)
100
1.0 -5 10
10-4
10-3
10-2
Forward current IF (A) Fig.4 Forward resistance vs. Forward current
Fig.3 Capacitance vs. Reverse voltage
Rev.4.00, Oct. 08.2003, page 3 of 4
HVM14
Package Dimensions
As of January, 2003
Unit: mm
(0.65)
0.10 3-0.4 + 0.05 -
0.16 - 0.06
+ 0.10
1.5 0.15
+ 0.2 - 0.6
0 - 0.1
(0.95) (0.95) 1.9 0.2
0.3 2.8 + 0.1 -
(0.3)
+ 0.2 1.1 - 0.1
(0.65)
2.8
Package Code JEDEC JEITA Mass (reference value)
MPAK(D) -- Conforms 0.011 g
Rev.4.00, Oct. 08.2003, page 4 of 4
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
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(c) 2003. Renesas Technology Corp., All rights reserved. Printed in Japan.
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